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TQIN Semiconductor Limited is committed to be your One-Stop reliable vendor for all kinds of electronic components. The original company was formed in 2018 who mainly focus on China domestic market while the founder has rich experience for more than 10 more years in sourcing high quality, cost-effective, obsolete parts.

When we noticed that the opportunity for overseas market is also very large and growing, TQIN Semiconductor Ltd was born in winnter,2020.

Story of TQIN Semiconductor

TQIN is a combination and abbreviation word from a famous Chinese four-character idioms: 天道酬勤(Tian Dao Chou Qin). It means a good fairy will help the people in secret who works very hard for their dreams. Therefore TQIN are devoting ourselves on having our own professional trusted-supply chain system, good quality parts, good after-sales services, long-term business relationship with customers as well as on each small aspect.

Our Main Advantages

Reliable Supply-chain

Cost-Competitive

New&Original parts

One-Stop Solution

Excellent Services

Strong Line Cards

Quality Assurance

When you suspect the quality of the electronic components, below tests may help you correspondingly.

þ External visual inspection

External visual inspection includes examination for evidence of prior use, secondary coating, socket pulls, re-tinning, lead reforming etc. External Visual Inspection, if properly performed, can lead to a high capture rate of suspect or fraudulent/counterfeit parts.

þ Pin Correlation Test

Most cost effective way to determine the probability a device is functional - compares a pin's signature measurements to every other pin looking for consistent I/V characteristics. This test detects gross defects such as opens, shorts, excessive leakage, ESD damage, etc. caused by improper handling or storage.

þ Solder ability Analysis

Sample(s) will be tested in accordance with J-STD-002D (Method: Hot Dip and Look) examined for evidence of porosity, voids, coverage, inconsistent wetting, etc.

þ X-Ray Analysis

X-ray analysis to verify that the internal lead frames, bonding wires and dice construction is consistent within the lot and against known good devices if possible. Die size, general shape, lead frame construction, wire bonding gauge and routing can be checked. In general, there should be no variation in parts with the same date and lot code.

þ XRF (Lead/Lead‐free)

XRF analysis determines the elemental composition of the leads/package of a component and is a useful test for Lead Finish Evaluation to determine lot consistency and confirm the presence or absence of lead (Pb) or other constituent elements.

þ Internal visual inspection

Internal Analysis of the device examines the die markings, internal package characteristics and topography and compares against a known good device if possible.