ZIO-101899
TQIN Code
TQ-ZIO-101899
Manufacturer
Smart Prototyping
Mfr Part #
ZIO-101899
Detailed Description
DataSheet
DataSheet
Product Attributes
TYPE
DESCRIPTION
Product Status
Active
Package
Bag
Proto Board Type
Connector to DIP
Material
FR4 Epoxy Glass
Package Accepted
2．54mm Header
Number of Positions
4
Pitch
0．100" (2．54mm)
Board Thickness
0．062" (1．57mm) 1/16"
Size / Dimension
1．00" L x 0．34" W (25．4mm x 8．6mm)
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.9000
Standard Package
1
In Stock： 498 Can Ship Immediately
Fill in below information to get a quote:
Submit
You May Also Be Interested In
PA0005
TQ-PA0005
Chip Quik Inc.
Detailed Information
PA0219SOCKET
TQ-PA0219SOCKET
Chip Quik Inc.
Detailed Information
PA0188
TQ-PA0188
Chip Quik Inc.
Detailed Information
Shenzhen office
Address： Room 522, 5th Floor, 101 Dong, shangbu industrial area, hua qiang North, Futian District, Shenzhen, China
Phone： 0086-0755- 2394 6805
Email：info@tqinsemi.com
HK office
TQIN Semiconductor Limited
Address： ROOM 01, 21/F, PROSPER COMMERCIAL BUILDING, 9 YIN CHONG STREET, KOWLOON, H.K
Phone： 00852-30697918
Skype ID： sales@tqinsemi.com
Email：info@tqinsemi.com
Website：www.tqinsemi.com
Quick navigation

Copyright © TQIN Semiconductor Limited