TQIN Semiconductor Limited

Thermal Resistance @ Forced Air Flow

20．00°C/W @ 300 LFM

8．13°C/W @ 200 LFM

15．00°C/W @ 400 LFM

5．61°C/W @ 200 LFM

10．00°C/W @ 600 LFM

25．00°C/W @ 200 LFM

9．10°C/W @ 200 LFM

7．26°C/W @ 200 LFM

3．00°C/W @ 200 LFM

30．00°C/W @ 200 LFM

30．00°C/W @ 500 LFM

1．50°C/W @ 700 LFM

35．00°C/W @ 200 LFM

1．30°C/W @ 200 LFM

1．50°C/W @ 400 LFM

2．00°C/W @ 400 LFM

1．00°C/W @ 800 LFM

9．70°C/W @ 200 LFM

1．50°C/W @ 600 LFM

2．00°C/W @ 800 LFM

11．70°C/W @ 200 LFM

7．40°C/W @ 200 LFM

6．00°C/W @ 300 LFM

3．00°C/W @ 500 LFM

5．00°C/W @ 200 LFM

1．50°C/W @ 500 LFM

8．00°C/W @ 400 LFM

9．30°C/W @ 200 LFM

6．00°C/W @ 500 LFM

3．00°C/W @ 400 LFM

Base Product Number

Thermal Resistance @ Natural

Width

Power Dissipation @ Temperature Rise

Fin Height

Length

Series

Package Cooled

Diameter

Length - Overall

Ribbon Width

Attachment Method

Height

Height (Max)

Height - Seated (Max)

Jacket (Insulation) Diameter

Height Above Board

Material Finish

Width - Outer Edges

Type

Shape

Overall Contact Length

Package

Material

Insulation Height

Width - Overall

Usage

Diameter - Inside

Diameter - Barrel OD

Contact Length - Post

Supplier Device Package

Product Status

Active

Obsolete

Discontinued at Digi-Key

Not For New Designs

Diameter - Outside

0．355" (9．02mm)

2．180" (55．37mm)

0．961" (24．40mm)

0．835" (21．20mm)

Large Diameter Supplied

2．360" (59．94mm)

2．390" (60．71mm)

2．400" (60．96mm)

2．480" (62．99mm)

Contact Length - Mating

0．235" (5．97mm)

0．272" (6．90mm)

0．089" (2．25mm)

0．457" (11．60mm)

Thickness - Overall

0．002" (0．06mm)

0．003" (0．07mm)

0．984" (25．00mm)

0．625" (15．90mm)

Thermal Resistivity

0．90°C/W

0．52°C/W

0．20°C/W

0．70°C/W

Length - Below Head

0．220" (5．59mm)

0．230" (5．84mm)

0．430" (10．92mm)

Inner Diameter - Recovered

1．670" (42．42mm)

0．437" (11．10mm)

0．357" (9．07mm)

Diameter - Barrel ID

0．547" (13．89mm)

1．193" (30．30mm)

0．484" (12．29mm)

Height - Overall

0．236" (6．00mm)

0．276" (7．00mm)

0．079" (2．00mm)

Mounting Type

Free Hanging (In-Line)

Stud Mount

Screw Holes Back

Inner Diameter - Supplied

5．900" (149．86mm)

0．255" (6．48mm)

Color

Silver

Ruby

Diameter - Inside Non-Expanded

0．473" (12．01mm)

1．697" (43．10mm)

Connector Type

QSFP

QSFP-DD (Double Density)

Accessory Type

Clip

Heat Spreader

Between Board Height

1．035" (26．30mm)

1．205" (30．61mm)

Termination Post Length

0．370" (9．40mm)

0．620" (15．75mm)

Shelf Life

12 Months

60 Months

Backing Carrier

Polyester

Aluminum

Contact Material

Copper

Copper Alloy

Insulation Diameter

0．440" (11．18mm)

0．515" (13．08mm)

Recovered Wall Thickness

0．113" (2．87mm)

Coil Diameter

2．055" (52．20mm)

Features

Fan Top

Interface

VGA

For Use With/Related Products

Raspberry Pi

Qmax @ Th

6．0W @ 25°C

Terminal Style

Two Stud Holes

Plating

Nickel

Thread/Screw/Hole Size

M8

Lamp Type

LED

Operating Temperature

1．642" (41．70mm)

Power (Watts)

0．5mW

Number of Positions

7

Wavelength

543nm

Size

PH3

Large Diameter Recovered

1．400" (35．56mm)

Small Diameter Supplied

1．180" (29．97mm)

Abrasive Material

Ceramic

Total Length Recovered

1．319" (33．50mm)

Length - Barrel

0．190" (4．83mm)

Contact Material - Mating

Beryllium Copper

Mounting Hole Spacing

1．023" (26．00mm)

Length - Shaft and Bearing

4．449" (113．00mm)

Termination

Crimp Barrel

Shell Finish

Black Cadmium

Opening Size

1．126" (28．60mm)

Contact Material - Post

Brass

Pitch

0．025" (0．64mm)

Wire Gauge

3/0 AWG

Terminal Type

Lug Grounding

Platform

Raspberry Pi 4B

Stud/Tab Size

1/2 Stud

Length - Ring Center to Termination

0．290" (7．37mm)

Length - Termination

0．460" (11．68mm)

Insulation

Non-Insulated

Diameter - Large Outside

1．510" (38．35mm)

Contact Finish

Tin

Package / Case

Cylinder (44．5mm Dia)